个人简历
研究兴趣
学术论文
[1] Xu He#*, Yushan Wang, Chenjing Yang, Renjun Zhao, Yibo Lin, Peiyu Liao, Bei Yu, Yao Wang, Chang Liu, Yang Guo, Efficient Timing Prediction and Optimization Using Derivable Gradient Boosting Machine Model at Placement Stage, ACM Transactions on Design Automation of Electronic Systems (TODAES), SCI, 2026. (Accept, CCF B)
[2] Tong Shen, Mengen Chen, Xu He*, Yao Wang and Yang Guo, 3D Chiplet Partitioning and Floorplanning Interaction with Vertical Bonding Consideration, Design, Automation and Test in Europe Conference (DATE), 2026. (Accept, CCF B)
[3] Haoying Wu*, Xiao Jiang, Yilun Fan, Xu He, Mingyu Liu, Topology Optimization-based Layer Assignment Method for Fixed-layer Complex PCBs, IEEE Transactions on Components, Packaging and Manufacturing Technology, SCI, 2026. (Accept, 二区)
[4] Guanxian Zhu, Mingyu Liu, Xu He, Haoying Wu*, Topological Optimization-Based Layer Assignment Method for Fan-Out Wafer-Level Packaging, Asia and South Pacific Design Automation Conference (ASP-DAC), 2026. (Accept, CCF C)
[5] Zhe Xiao, Xu He*, Haoying Wu, Bei Yu, Yang Guo, EDA-Copilot: A RAG-Powered Intelligent Assistant for EDA Tools, ACM Transactions on Design Automation of Electronic Systems (TODAES), v30(6), 2025, SCI, (CCF B)
[6] Yushan Wang, Xu He*, Renjun Zhao, Yao Wang, Chang Liu, Yang Guo, SI-Aware Wire Timing Prediction at Pre-Routing Stage with Multi-Corner Consideration, Asia and South Pacific Design Automation Conference (ASP-DAC), pp401-406, 2025. (CCF C)
[7] Congyi Zhang(本), Xu He*, Hao Sang, Hengzhou Yuan, Dawei Liu, Yang Guo, A general and accurate pattern search method for various scenarios, Integration, the VLSI Journal, v100(102281), 2025. (CCF C, JCR二区)
[8] Chao Xiao#, Xu He, Zhijie Yang, Xun Xiao, Yao Wang, Rui Gong, Junbo Tie, Lei Wang*, Weixia Xu, Hierarchical Mapping of Large-Scale Spiking Convolutional Neural Networks Onto Resource-Constrained Neuromorphic Processor, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2023, SCI (CCF A)
[9] 贺旭#,王耀,傅智勇,李暾,屈婉霞*,万海,张吉良,敏捷设计中基于机器学习的静态时序分析方法综述,计算机辅助设计与图形学报 (JCAD),2022 (CCF A)
[10]Xu He#*, Zhiyong Fu, Yao Wang, Chang Liu, Yang Guo. Accurate Timing Prediction at Placement Stage with Look-Ahead RC Network, Proc. ACM Design Automation Conference (DAC), 2022, EI (CCF A)
[11] Xu He#, Tao Huang, Linfu Xiao, Haitong Tian, and Evangeline F.Y. Young*. Ripple: A Robust and Effective Routability-Driven Placer, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 32(10), pp1546-1556, 2013, SCI (CCF A)
[12] 李暾#,贺旭,屈晚霞*,万海,微处理器敏捷设计方法综述,计算机辅助设计与图形学报 (JCAD),2020 (CCF A)
[13] Xu He#, Tao Huang, Wing-Kai Chow, Jian Kuang, Ka-Chun Lam, Wenzan Cai and Evangeline F.Y. Young*. Ripple 2.0: High Quality Routability-Driven Placement via Global Router Integration, Proc. ACM Design Automation Conference (DAC), pp 152, 2013, EI (CCF A)
[14]Xu He#*, Yao Wang, Zhiyong Fu, Yipei Wang, Yang Guo, A General Layout Pattern Clustering Using Geometric Matching Based Clip Relocation and Lower-Bound Aided Optimization, ACM Transactions on Design Automation of Electronic Systems (TODAES), v28(6), 2023, SCI (CCF B)
[15] Xu He#*, Yao Wang, Chang Liu, Qiang Wu, Juan Luo, Yang Guo, A Soft-Error Mitigation Approach Using pulse Quenching Enhancement at Detailed Placement for Combinational Circuits, ACM Transactions on Design Automation of Electronic Systems (TODAES), v28(4), 2023, SCI (CCF B)
[16] Xu He#*, Yipei Wang, Zhiyong Fu, Yao Wang, Yang Guo. Maximum Clique Based Method for Optimal Solution of Pattern Classification, ICCD, 2020, EI (CCF B)
[17] Xu He#*, Yu Deng, Shizhe Zhou, Rui Li, Yao Wang, Yang Guo. Lithography Hotspot Detection with FFT-based Feature Extraction and Imbalanced Learning Rate, ACM Transactions on Design Automation of Electronic Systems (TODAES), 2019, SCI (CCF B)
[18] Xu He#*, Yao Wang, Yang Guo. “Ripple 2.0: Improved Movement of Cells in Routability-Driven Placement”, ACM Transactions on Design Automation of Electronic Systems (TODAES), 22(1), 2016, SCI (CCF B)
[19] Xu He#, Tao Huang, Linfu Xiao, Haitong Tian, Guxin Cui, Evangeline F.Y. Young*. Ripple: An Effective Routability-Driven Placer by Iterative Cell Movement, Proc. ACM/IEEE International Conference on Computer-Aided Design (ICCAD), USA. pp. 74-79, 2011, EI (CCF B)
[20] Chang Liu#, Long Zhang, Xu He, Yang Guo*. Analysis of SET Reconvergence and Hardening in the Combinational Circuit Using a SAT-Based Method, IEEE ACCESS, 2018, v6, pp48740-48746, SCI (JCR二区)
[21] Chang Liu#, Xu He, Bin Liang, Yang Guo*. Detailed Placement for Pulse Quenching Enhancement in Anti-Radiation Combinational Circuit Design, Integration, the VLSI journal, 2018, v62, 182-189, SCI (CCF C)
[22] Xu He#, Sheqin Dong*, Yuchun Ma. Signal Through-the-Silicon Via Planning and Pin Assignment for Thermal and Wire Length Optimization in 3D ICs. Integration, the VLSI Journal, 43(4), pp342-352, 2010, SCI (CCF C)
[23] Xu He#*, Yao Wang, Yang Guo, Sorin Cotofana. A Mixed-Size Monolithic 3D Placer with 2D Layout Inheritance, ACM Great Lakes Symposium on VLSI (GLVLSI), 2017, EI (CCF C)
[24] Wing-Kai Chow#, Jian Kuang, Xu He, Wenzan Cai and Evangeline F.Y. Young*. Cell Density-driven Detailed Placement with Displacement Constraint, International Symposium on Physical Design (ISPD), Petaluma, USA, 2014, EI (CCF C)
[25] Xu He#, Wing-Kai Chow and Evangeline F.Y. Young*. SRP: Simultaneous Routing and Placement for Congestion Refinement, Proc. ACM International Symposium on Physical Design (ISPD), USA. pp. 108-113, 2013, EI (CCF C)
[26] Yande Jiang#, Xu He, Chang Liu, Yang Guo*. An Effective Analytical 3D Placer in Monolithic 3D IC Designs, The 11th IEEE International Conference on ASIC, Sichuan, 2015, EI
[27] Xu He#, Sheqin Dong*, Yuchun Ma, Xianlong Hong. Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning, Proc. Of IEEE International Symposium on Quality Electronic Design (ISQED), USA. pp. 740-745, 2009, EI
[28] Xu He#, Sheqin Dong*, Xianlong Hong, Satoshi Goto. Integrated Interlayer Via Planning and Pin Assignment for 3D ICs, Proc. Of ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP), USA. pp. 99-104, 2009, EI
[29] Xu He#, Sheqin Dong*. Pin Assignment for Wire Length Minimization after Floorplanning Phase, Proc. of IEEE International Conference on ASIC (ASICON), China. pp. 1294-1297, 2009, EI
[30] 刘畅#,贺旭,梁斌,郭阳*,增强组合电路脉冲窄化效应的软错误率优化布局方法,计算机辅助设计与图形学学报(JCAD),2018. (CCF A)
[31] 蒋艳德#,刘畅,贺旭,郭阳*,面向标准单元三维布局的密度驱动划分方法,计算机辅助设计与图形学学报(JCAD),(11):2021~2026,2016.(CCF A)
[32] 刘畅#,郭泽晖,贺旭,郭阳*,时序驱动的详细布局方法,国防科大学报,2018, EI
专利
[1] 符永睿,贺旭,王宇珊,吴强,一种面向混合尺寸的网表级线长预测方法,中国,申请号:2025103822896.
[2] 杨晨静,贺旭,李彦辰,吴强,一种芯片设计布局阶段基于 LLM 的混合尺寸聚类方法,中国,申请号:2025103542077.
[3] 邓宇(飞腾公司),贺旭,彭书涛(飞腾公司),一种时序分析方法及相关装置,中国,申请号:202411087230.6,已授权.
[4] 邓宇(飞腾公司),贺旭,创建候选剪辑区域的方法、装置、电子设备及存储介质,中国,已授权,专利号:ZL 2023 1 1181981.X.
[5] 贺旭,刘畅,李暾,屈婉霞,吴强,张吉良,考虑脉冲窄化的软错误布局优化方法,中国,授权号:ZL 2023 1 0208293.1.
[6] 贺旭,傅智勇, 物理设计布局阶段的时序预测方法,中国,授权号:ZL 2022 1 0088465.1.
[7] 贺旭,李琼,蒋政涛,傅智勇, 基于LightGBM的网表级的线时延预测方法,中国,申请号:202110886657.2. 已授权
[8] 贺旭,傅智勇, 一种获取电路连线拓扑信息的方法,中国,授权号:ZL 2020 1 0269856.4.
[9] 贺旭,汪一沛, 一种版图热点聚类方法,中国,授权号:ZL 2020 1 0270524.8.
[10] 贺旭,邓宇,一种基于FFT特征提取的热点检测方法,中国,申请号:201811217831.9.
科研状况